KYANITE 355

55 W at 355 nm

The KYANITE 355 series are high-power diode-pumped solid-state (DPSS) lasers generating nanosecond pulses with pulse repetition rates up to 300 kHz in the ultraviolet (355 nm) spectral range.

The combination of high average power, excellent beam quality, output parameter stability, and long operating lifetime makes KYANITE 355 lasers an effective tool for high-precision industrial micromachining.

  • Output power up to 55 Watt at 355 nm
  • Pulse repetition rate up to 300 kHz
  • Beam quality TEM00 mode; M² < 1.2
  • High output power stability ≤ 3%
  • Sealed industrial housing
  • Built-in energy meter
  • Service interval > 10,000 hours
SKU: 002-2-1-1-1-1-1-2 Categories: ,

Description

KYANITE lasers are perfectly suited for precision PCB processing, silicon wafer micromachining, thin-film patterning, glass and ceramic processing, polymer cutting and marking, microelectronics manufacturing, and high-precision industrial engraving. Powered by 355 nm UV light, these lasers ensure highly efficient absorption across a vast range of materials while keeping the heat-affected zone (HAZ) to a minimum.

Built with unique engineering solutions, KYANITE lasers offer enhanced long-term stability of output parameters and exceptional durability under harsh industrial operating conditions.

The compact dimensions of both the laser head and the power supply unit ensure seamless integration into automated production lines and specialized laser workstations.

Model Kyanite 355-30 Kyanite 355-55
Laser wavelength, nm 355
Pulse repetition rate, Hz Single shot to 300 kHz
Output power at 150 kHz, W ≥ 30 ≥ 55
Pulse energy at repetition rate up to 150 kHz, µJ ≥ 200 ≥ 350
Pulse duration, ns 10 – 15
Beam diameter, mm 3.5
Beam divergence, mrad < 0.2 < 0.4
Output power stability, % ≤ 3
Pulse energy stability, % ≤ 3
Beam quality TEM00 mode, М2< 1.2
Cooling Water-to-air
Power requirement (110–240 V, 50–60 Hz), W ≤ 4500
Laser head dimensions, max, mm 660 х 280 х 200
Power supply dimensions, max, mm 330 х 310 х 130

Specifications are subject to change without prior notice.

kyanite_dimensions

  • Wire stripping (insulation removal)
  • ABS film cutting
  • Rubber and polymer processing
  • Depaneling and cutting of printed circuit boards (PCB) and flexible printed circuit boards (FPCB)
  • Drilling and scribing on ceramic materials
  • Carbon fiber cutting and shaping
  • Fine surface treatment and micromechanical processing
  • Non-destructive UV marking of plastic materials
  • Photolithography process engineering